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Thông số PCB

FeaturesCapabilityNotesPatterns
Layer count1,2,4,6 layersThe number of copper layers in the board.
Controlled Impedance4/6 layer, default layer stack-upControlled Impedance PCB Layer Stackup
JLCPCB Impedance Calculator
MaterialFR-4FR-4 Standard Tg 130-140/ Tg 155
Dielectric constant4.5(double-side PCB)

7628 structure 4.6

2313 structure 4.05

2116 structure 4.25

Max. Dimension400x500mmThe maximum dimension JLCPCB can accept
Dimension Tolerance±0.2mm±0.2mm for CNC routing, and ±0.4mm for V-scoring
Board Thickness0.4/0.6/0.8/1.0/1.2/1.6/2.0mmThe thickness of finished board.
Thickness Tolerance

( Thickness≥1.0mm)

± 10%e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)

Thickness Tolerance

( Thickness<1.0mm)

± 0.1mme.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
Finished Outer Layer Copper1 oz/2 oz (35um/75um)Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper0.5 oz (17um)Finished copper weight of inner layer is 0.5oz only.

Drill/Hole Size

FeaturesCapabilityNotesPatterns
Drill Hole Size (Mechanical)0.20mm- 6.30mmMin. drill size is 0.20mm. Max. drill size is 6.30mm.
Drill Hole Size Tolerance+0.13/-0.08mme.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.
Blind/Buried ViasDon’t supportCurrently we don’t support Blind/Buried Vias, only make through holes.
Min. Via hole size0.2mmFor Single&Double Layer PCB, the minimum via hole size is 0.3mm;For Multi Layer PCB, the minimum via hole size is 0.2mm
Min. Via diameter0.45mmFor Single&Double Layer PCB, the minimum Via diameter is 0.6mm;For Multi Layer PCB, the minimum via diameter is 0.45mm.
PTH hole Size0.20mm – 6.35mmThe annular ring size will be enlarged to 0.15mm in production.
Pad Size0.70mm- 6.35mmThe pad hole size will be enlarged 0.15mm in production.
Min. Non-plated holes0.50mmThe minimum NPTH dimension is 0.50mm, Please add the NPTH in the mechanical layer or keep out layer.
Min. Plated Slots0.65mmThe minimum plated slot width is 0.65mm, which is drawn with a pad.
Min. Non-Plated Slots1.0mmThe minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO)
Min. Castellated Holes0.60mmThe minimum diameter of castellated holes is 0.60mm.
Hole size Tolerance (Plated)+0.13mm/-0.08mme.g. for the 1.00mm Plated hole, the finished hole size between 0.92mm to 1.13mm is acceptable.
Hole size Tolerance (Non-Plated)±0.2mme.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.
Rectangle Hole/SlotDon’t supportWe don’t make rectangle hole/slot,the rectangle hole/slot will be made as round or oval hole/slot by default.

Minimum Annular Ring

Minimum annular ringPTHPatterns
1oz Copper0.13mm0.3mm
2oz Copper0.2mm0.3mm

Minimum clearance

FeaturesCapabilitiesPatterns
Hole to hole clearance(Different nets)0.5mm
Via to Via clearance(Same nets)0.254mm
Pad to Pad clearance(Pad without hole, Different nets)0.127mm
Pad to Pad clearance(Pad with hole, Different nets)0.5mm
Via to Track0.254mm
PTH to Track0.33mm
NPTH to Track0.254mm
Pad to Track0.2mm

Minimum trace width and spacing

Copper weightMin. Trace widthMin. SpacingPatterns
H/HOZ (Inner layer)5mil (0.127mm)5mil (0.127mm)
1oz (Outer layer)1/2 layers: 5mil (0.127mm)
4/6 layers: 3.5mil(0.09mm)		1/2 layers: 5mil (0.127mm)
4/6 layers: 3.5mil(0.09mm)
2oz (Outer layer)8mil (0.2mm)8mil (0.2mm)

BGA

Layer countMin. BGA Pad DimensionsMin. Distance Between BGAPatterns
1/2 layers0.4 mm0.127mm
4/6 layers0.25 mm0.127mm

Solder Mask

FeaturesCapabilitiesNotesPatterns
Solder mask opening/ expansion0.05mmThe solder mask should have a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration.
Solder bridge0.2mm(green)

0.254mm(other colors)

To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more.
Solder mask colorgreen, red, yellow, blue, white, and black.We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today.
Solder mask dielectric constant3.8
Solder mask thickness10-15UM

Legend

FeaturesCapabilitiesNotesPatterns
Minimum Line Width6 mil (0.153mm)Characters width less than 6mil(0.153mm) will be unidentifiable.
Minimum text height32 mil (0.8mm)Characters height less than 32mil(0.8mm) will be unidentifiable.
Character width to height ratio1:6The preferred ratio of width to height is 1:6.
Pad To Silkscreen0.15mmThe Minimum Distance Between Pad and Silkscreen is 0.15mm.

Board Outlines

FeaturesCapabilitiesNotesPatterns
Trace to Outline0.2mmShips as individual board(Rounting):Trace to Outline≥0.2mm
Trace to V-cut line0.4mmShip as panel with V-scoring: Trace to V-cut line≥0.4mm

Panelization

FeaturesCapabilitiesNotesPatterns
Panelization without space0mmThe space between boards is 0mm.
Panelization with space2mmMake sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding.
Panelized Round board≥20mmx20mm

The single round board size should be≥20mmx20mm.

Panelize with stamp holes and add tooling strips on four board edges

Panelized castellated holes boardPanelize with stamp holes and add tooling strips on four board edges

The distance between castellated hole and board corner should be larger than 4mm.

Recommended diameter of stamp hole is 0.5mm-0.8mm;

Recommended distance between the two stamp holes is 0.2-0.3mm


Min. Width of Breakaway Tab4mmThe minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm.
Min. Edge Rails4mmIf choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default.

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